1. 2. 3. material content data sheet sales product name bso612cv g issued 29. august 2013 ma# MA000982368 package pg-dso-8-7 weight* 81.35 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 2.490 3.06 3.06 30608 30608 leadframe inorganic material phosphorus 7723-14-0 0.009 0.01 114 non noble metal zinc 7440-66-6 0.037 0.05 456 non noble metal iron 7439-89-6 0.742 0.91 9117 non noble metal copper 7440-50-8 30.114 37.02 37.99 370201 379888 wire noble metal gold 7440-57-5 0.443 0.54 0.54 5447 5447 encapsulation organic material carbon black 1333-86-4 0.226 0.28 2778 inorganic material antimonytrioxide 1309-64-4 0.904 1.11 11110 plastics brominated resin - 0.904 1.11 11110 plastics epoxy resin - 5.197 6.39 63885 inorganic material silicondioxide 60676-86-0 37.959 46.66 55.55 466637 555520 leadfinish non noble metal tin 7440-31-5 0.814 1.00 1.00 10005 10005 plating noble metal silver 7440-22-4 0.541 0.67 0.67 6656 6656 glue plastics epoxy resin - 0.169 0.21 2078 noble metal silver 7440-22-4 0.797 0.98 1.19 9798 11876 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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